KainovaTech

About Us

Founded in 2019 as a subsidiary company under Foxconn/ Foxsemicon Technology Group, Kainova believes in flexibility, adaptability, and meeting customers' needs efficiently. Kainova welcomes challenges and values profession. With 20+ years of experience and our parent companies' production capacity, we aspire to provide advanced equipment, introduce engineering solutions and build innovative business models for semiconductor industry.
Nowadays Kainova has become world-leading eqiupment company in the fields of 2nm micro contamination control and EUV-era semiconductor front-end automation.

Vision and Mission

We strive to enhance yield and productivity for semiconductor fabrication customers by:


1. Offering reliable semiconductor fabrication automation solutions.

2. Delivering comprehensive solutions for micro-contaminant control.

3. Producing accurate wafer inspection systems.

4. Providing quality semiconductor equipment CIP and retrofit services.

Core Value

Professional brand and products
  • Focus on semocinductor front-end advanced processes, EUV reticle processes and ultra-clean wafer automation.
  • Speed, quality, performance, flexibility, service
Sustainable operation performance
  • Sustainability=EPS+ESG
Human-oriented culture
  • 'People' is the most important asset of the company.
  • Continuously invest in talents of marketing, technology and service.
  • Emphasize team work, effective communication, EQ and working circumstance.
Open innovation thinking
  • Willing to accept different point of view from internal and external.
  • Non-stop passion of researching new technology and developing new product.

Our Team

Proficient in Semiconductor Equipment Development:

  • With over 20 years of experience, we are well-established in semiconductor equipment, factory automation and micro-contamination prevention.

Comprehensive Semiconductor Equipment Design Capabilities:

  • Ultra-clean mechanism designs, circuit designs, engineering analysis, motion control, PC/ PLC software development, semiconductor SECS/ GEM communication development, system design solutions.

Open Innovation and Constant Breakthrough:

  • We collaborate with global partner, research institutes and top universities to ensure world-leading technology.

Locations

Headquarters: 5F, No.16, Kejung Rd., Hsinchu Science Park, Chunan Township, Miaoli County 350-53, Taiwan, R.O.C. (R&D, Manufacture, Sales, After Service) Southern Taiwan Science Park Office: Shanhua District, Tainan City (Sales, After Service) China Office: Kunshan, Jiangsu Province (Sales, After Service) U.S.A. Office: Phoenix, Arizona 95085 (After Service) Japan Office: Kumamoto City, Kumamoto Prefecture (After Service)