Overview

• Micro contamination has tremendously caused yield reduction, poor productivity and degradation of equipment in wafer processes as the semiconductor technology stepped into 20nm node. An active and effective solution of controlling micro contamination and monitoring the wafer environment is urgently demanded from advanced semiconductor fabs.
• Furthermore, the queue time between each wafer processes is getting more and more short and critical due to the continuous shrinkage in linewidth of the semiconductor fabrication. In order to increase the queue time and reduce the defects, it is necessary to keep the humidity or oxygen inside the FOUP at an extremely low state.
• Kainova's PAMCOH™ active micro contamination control total solutions protect wafers within processes, transportation and storage without dead zone.

Load Port N2 Purge SubSystem

Features

• SCUBA® load port N2 purge subsystem is a minimized module which can be installed into all brands of load ports in the market. It purges N2 in to FOUP, reduces humidity and oxygen around wafers and monitors the condition inside FOUP in real-time.
• SCUBA® load port N2 purge subsystem provides an proven excellent solution. It had been installed in the most advanced wafer fabs for more than 20,000 installation records.
• Instantly upgrade existing load port into N2 purge load port
• Provide protection from AMC throughout all wafer processes
• Proven performance of increasing yield and productivity
• Control by CIM and can be monitored through FDC

Performance

• Built-in temperature, humidity, flow rate and pressure sensors for real-time monitor, and optional oxygen detector
• Max purge flow rate 200 LPM max
• Built-in high purity particle filter, up to 99.9999999% @>0.003um
• Compliant with SECS/GEM communication protocol
• SEMI S2 certificated
• Purge performance: humidity inside FOUP < 1% after 2 mins purge (depend on FOUP condition)
• Fit to all brands of process tool and load port in the market

Clean Air Curtain

Features

• The clean air curtain is installed above the load port door to block the air convection between EFEM and FOUP, so as to maintain low humidity inside the FOUP

Performance

• Max purge flow rate 350 LPM max
• Integrated in Kainova's load port N2 purge subsystem, compliant with SECS/GEM communication protocol
• Humidity-blocking performance: keep humidity inside FOUP < 5% (depend on EFEM condition)
• Fit to all brands of process tool and load port in the market

Stand Alone N2 Charger

Features

• A stand alone equipment to purge N2 into FOUP
• Light weight design and easy to move
• Compliant with AMHS auto load/unload
• Real time monitoring of the condition inside FOUP
• Flexible and suitable for new process evaluation

Performance

• Built-in temperature, humidity, flow rate and pressure sensors for real-time monitor
• Max purge flow rate 200 LPM max
• Built-in high purity particle filter, up to 99.9999999% @>0.003um
• Compliant with SECS/GEM communication protocol
• Compliant with SEMI S2 safety standard
• Purge performance: humidity inside FOUP < 1% after 2 mins purge (depend on FOUP condition)