Overview

Application

• In advanced semiconductor processes, traditional DI water + megasonic is not able to completely remove the nano-scale particles on the surface of the wafer. It is necessary to dissolve specific gases in DI water and then form functional water to improve the cleaning process capability

Added Values

• Anti-rust effect of metal materials
• Reduce chemical consumption
• Reduce waste water
• Eliminate electrostatic for DI Water

Ammonia Water Supply System

Features

• Conductivity control technology to control stable ammonia concentration
• High stable conductivity, the conductivity will not be affected by the flow rate and temperature changes

Principles

• Repulsion: Ammonia water releases OH¯ ions which repels the negative electricity particles on the wafer
• Oxide Layer: Ammonia water forms oxide layer on wafer surface and protect wafer from particle's adhering

Ozone Water Supply System

Features

• High cleanliness
• High concentration stability
• Low attenuation
• Small volume

Functions

• Sterilization, Purification: 1~2ppm
• Oxide Protective Layer: 2~5ppm
• Particle Removal: 5~10pm
• Organic Removal: 5~30ppm
• Organic Layer Etching: 5~30ppm
• Metal Ion Removal: 5~30ppm
• Photoresist Removal/Clean: 50~80ppm (>120ppm, depend on conditions)